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Wet etching device "BATCHSPRAY Autoload"

100% focus on BATCHSPRAY technology! Significantly reduces water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry] Fully automated system.

This two-chamber system not only provides excellent etching uniformity but also reduces chemical usage. It accommodates all types of wet etching processes. It includes high-precision mixing of chemicals in the tank, endpoint detection (EPD), and a patented retainer comb processing system. Furthermore, SicOzone resist stripping can be applied in the same chamber, enhancing flexibility and reducing processing steps. 【Features】 ■ Throughput of up to 300 wph ■ For wet etching, resist stripping, and cleaning processes ■ Two process chambers ■ Uniformity with less than 1% variation ■ Installation area of less than 12 m² ■ Chemical recycling and reuse through a tank system ■ Capable of processing SiC/GaN *For more details, please refer to the PDF document or feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Wet Etching Equipment

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Fundamental and Fine Processing Correspondence in Wet Etching and Development of Advanced Material Applications

What is the cutting-edge etching for the formation of transparent electrode patterns for next-generation power device substrates, touch panels, and fine-pitch electronic components?!

**Lecturer** Mr. Kimihiko Ikeda, Head of the Implementation Materials Research Laboratory, Electronic Materials Development Research Institute, Research and Development Division, ADEKA Corporation **Target Audience** Engineers, researchers, and beginners interested in wet processes and wet etching technology **Venue** Tokyo Chuo Ward Industrial Hall, 4th Floor, Meeting Room 4 [Tokyo, Nihonbashi] 5 minutes from B4 exit via underground passage from Bakuroyokoyama Station on the Toei Shinjuku Line (Directions 2) 5 minutes from C1 exit via East Exit ticket gate from Bakurocho Station on the JR Sobu Rapid Line (Directions 3) **Date and Time** December 26, 2011 (Monday) 13:30-16:30 **Capacity** 20 participants. *Registration will close once full. Please apply early.* **Participation Fee** **[Early Bird Discount Price]** 46,200 yen (tax included, including text costs) for up to 2 participants from one company. *Limited to Tech-Zone members who apply by December 12. Membership registration is free.* *After December 12, the [Regular Price] will be 49,350 yen (tax included, including text costs) for up to 2 participants from one company.*

  • 企業:AndTech
  • 価格:10,000 yen-100,000 yen
  • Technical Seminar
  • Wet Etching Equipment

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